Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering (Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method) (1st edition)

$29.99 Original price was: $29.99.$24.99Current price is: $24.99.

Download Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering (Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method) written by Seonho Seok in PDF format. This book is under the category Technology & Engineering and bearing the isbn13 numbers 9783319778716/9783319778723. You may reffer the table below for additional details of the book. We do NOT provide access codes, we provide eBooks ONLY. Instant access will be granted as soon as you complete the payment.